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die sorter HJC-560T

Die Sorter

芯片挑选至托盘/华夫盒 HJC-560T

自动晶圆到华夫盒挑选设备，带MAPPING功能。Wafer自动装载和卸载可选;可选2×2或4×4华夫盒包装，可选弹夹自动装载/卸载。

快速咨询

设备特点:

  1. 直驱式固晶邦头，180°摆臂旋转，可自由定制6英寸、8英寸和12英寸晶圆，以及子环和铁环相关处理设备；

  2. 根据晶圆尺寸（L、W、H），定制多顶针或单顶针机构；
  3. 晶圆工作台可以配备离子风扇；
  4. 晶圆台自动搜索机构，自动形成搜索轨迹；
  5. 根据映射文件自动搜索模具。
  6. 大吸力专用真空吸嘴；
  7. 大吸力多吸盘真空夹具；
  8. 使用真空泄漏检测；
  9. 华夫盒放置检查功能；
  10. 识别有缺陷的芯片，如缺角和墨点；
  11. 简单的可视化操作界面简化了操作；

芯片挑选：Wafer到华夫盒/托盘

方案定制

输出到华夫盒或者 JEDEC盘

可为倒装芯片定制

上下料可以定制为自动上下料

带Mapping 功能

 

 1. System functions 4. Die suction swing arm
Speed UPH:10K+/H (related to wafer size and blue film viscosity, subject to actual test results). Swing arm 180 rotatable
XY position accuracy ±25um Suction pressure Adjustable 30g—300g
Chip rotation ±3° 5. Wafer platform
2. Chip XY workbench Range of travel stroke Customized
Chip size 0.2mm×0.2mm-5mm×5mm (more size can be compatible by changing the lens barrel). XY resolution 0.02mil
Maximum chip ring size 6 “(other sizes can be customized). 6. Required facilities
Maximum chip area size 4″ Voltage/frequency 220V AC±5%/50HZ
Resolution ratio 0.04mil Compressed air 0.5MPa（MIN）
Z height stroke of thimble 4mm / Resolution: 0.04mil Rated power 800W
3. Image recognition system Gas consumption 5L/min
Gray scale 256 gray scale 7. Size and weight
resolution ratio 752×480 pixels (maximum 130W pixels) Long x wide x high 130×120×170cm
Accuracy of image recognition ±0.025mil@50mil observation range Weight 630kg

Key words: 

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