Die Sorter
芯片挑选编带设备 HJC-560R
晶圆到编带。载带轨道宽度可以调整。
设备功能:
- 直驱式固晶邦头，180°摆臂旋转。
- 多顶针设计，方便适配不同类型尺寸的晶圆芯片。
- 130万像素视觉，精确定位。
- 手工上下Wafer.
- 12寸Wafer平台通过不同治具可兼容8 寸, 6 inch wafer.
- 准确计数功能.
- 中英文操作界面.
- 载带轨道宽度可调.
- 可以对接 MES. (可选)
芯片挑选设备：Wafer到编带
设备可按客户要求定制。
| Content | Specification |
| UPH | ≥5k（related with wafer size/die size) |
| X、Y pick and place accuracy | ±25um |
| Angle accuracy | ±3° |
| Wafer ring size | 12inch、8inch、6inch、Automatic ring expanding mechanism |
| CCD max accuracy | 1um |
| Nozzle | 1PCS (nozzle pressure can be adjusted within 30g~300g) |
| Needle pin | 1PCS，multiple needle（optional） |
| Carrier tape width | Carrie tape complied with EIA481 standard. Track width is adjustable. |
| Load and unload | Manual loading/unloading (Automatic is optional) |
| Power input | AC 220V/50Hz |
| Power consumption | 800 W |
| Air input | 4~6 Bar |
| Machine size (W*D*H) | 1090*750*1600mm (with light) |
| Net weight | 1200 Kg |
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