Die Bonder
固晶机 HJC-560D
全自动固晶机。Wafer可自动上下料（可选）
Automatic die bonding machine, die attach equipment. Waffer automatic loading and unloading is optional.
设备功能特点:
一、直驱式固晶邦头，180°摆臂旋转
二、 多顶针设计，方便适配不同类型尺寸的晶圆芯片
三、130万解析度视觉系统，对晶片、框架进行定位
四、伺服直连式高精密沾胶系统，可画胶
五、手动上下料载具
六、固晶工作台模组，采用直线电机及高精度光栅尺
七、晶环可适用12寸、8寸、6寸铁环晶圆片
高精度固晶机
设备方案可定制
Re:固晶机 HJC-560D
规格参数
| Product application | MEMS， Storage, CIS, optoelectronics, etc | |
| Accuracy | ± 1.5um (standard patch) | |
| Equipment efficiency | 5S (standard patch, one pick&place); Excluding temperature curve | |
| Installation system | X/Y/Z | Travel: 350mmx500mmx50mm |
| Rotation axis | Travel: 360 °; Repetitive positioning accuracy: 0.02 ° | |
| Minimum suction size | 0.15*0.2mm | |
| Suction nozzle | Automatic nozzle replacement, one nozzle holder supports 13 nozzles | |
| pressure | 10-2000g (pressure real-time closed-loop feedback) | |
| Material system | Standard configuration | 2×2″/4×4″ gel pack/waffle pack |
| Standard configuration | 6 “/8” blue film system | |
| Preheating workbench | Temporary carrier board | Supports both soft and hard boards; Supports large-sized carrier boards |
| size | 300x300mm, customizable | |
| temperature range | 25-200℃ | |
| Flip system | Optional configuration | 180 ° flipping, customized for specific application nozzles |
| vision system | type | Two down view cameras and one high magnification up view camera |
| light source | Each camera is equipped with 4 programmable lights (collimated white light, circular RGB tricolor light) | |
| Factory requirements | source | 200-240VAC 50HZ single phase 20A |
| compressed air | 0.6Mpa 300L/min | |
| nitrogen | 0.3Mpa 30L/min 99.9% or higher | |
| vacuum | minus 80kpa 120L/min (Pipeline vacuum or vacuum pump) | |
| Weight | Around 2000kg |
Key words:
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